funded by the Fundamental Research Funds for the Central Universities,China(Nos.DUT21GF403,DUT22YG210,DUT22LAB117);the High Level Talents Innovation Plan of Dalian,China(No.2020RD02);financial support from the Shenzhen Science and Technology Innovation Commission Project,China(No.JSGG20210420091802007)。
Laser ablation is an important process during Laser-Assisted Grinding(LAG)of hard and brittle materials.To realize controllable material removal during laser ablation of RB-SiC composites,ablation experiments under di...