云南高校图书馆联盟文献共享服务平台- 国家自然科学基金(50274014)

国家自然科学基金(50274014): 作品数：14被引量：109H指数：7; 导出分析报告; 相关作者：曲选辉贾成厂叶斌何新波任淑彬更多>>; 相关机构：北京科技大学更多>>; 相关期刊：《复合材料学报》《International Journal of Minerals,Metallurgy and Materials》《Transactions of Nonferrous Metals Society of China》《Progress in Natural Science:Materials International》更多>>; 相关主题：SICP/AL复合材料SIC注射成形体积分数SIC_P/AL复合材料更多>>; 相关领域：一般工业技术金属学及工艺冶金工程化学工程更多>>

Review of metal matrix composites with high thermal conductivity for thermal management applications被引量：25: 《Progress in Natural Science:Materials International》2011年第3期189-197,共9页Xuan-hui QU Lin ZHANG Mao WU Shu-bin REN; Projects(2006AA03Z557,2008AA03A237) supported by the National High-tech Research and Development Program of China;Projects (2006CB605207,2011CB606306) supported by the National Basic Research Program of China;Projects(50274014,50634010, 50774005,51004010) supported by the National Natural Science Foundation of China; Metal matrix composites with high thermal conductivity and tailorable coefficient of thermal expansion are found widespread applications in electronic package and thermal management.The latest advances in manufacturin...; 关键词：metal matrix composites electronic PACKAGING THERMAL CONDUCTIVITY COEFFICIENT of THERMAL EXPANSION BRAZING

Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiC_p/Al composites被引量：3: 《Transactions of Nonferrous Metals Society of China》2010年第6期958-965,共8页吴茂曲选辉何新波 Rafi-ud-din 任淑彬秦明礼; Projects(50274014, 50774005) supported by the National Natural Science Foundation of China;Project(2006CB605207) supported by the National Basic Research Program of China;Project(2006AA03Z557) supported by the National High-tech Research and Development of China;Project(I2P407) supported by MOE Program for Changjiang Scholars; A novel Sn-2.5Ag-2.0Ni alloy was used for soldering SiCp/Al composites substrate deposited with electroless Ni(5%P) (mass fraction)and Ni(10%P)(mass fraction)layers.It is observed that variation of P contents in the e...; 关键词：SnAgNi solder electroless Ni（P） SiCp/Al composites intermetallic compound interfacial reaction

Effect of powder mixing process on the microstructure and thermal conductivity of Al/diamond composites fabricated by spark plasma sintering被引量：17: 《Rare Metals》2010年第1期86-91,共6页CHU Ke, JIA Chengchang, LIANG Xuebing, and CHEN Hui School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China; supported by the Civil Matching Research Project (No. 28300007);the National Natural Science Foundation of China (No. 50274014); Two powder mixing processes, mechanical mixing （MM） and mechanical alloying （MA）, were used to prepare mixed Al/diamond powders, which were subsequently consolidated using spark plasma sintering （SPS） to produce...; 关键词：metal matrix composites thermal properties SINTERING powder mixing

Preparation,crystallization,and wetting of ZnO-Al_2O_3-B_2O_3-SiO_2 glass-ceramics for sealing to Kovar被引量：4: 《International Journal of Minerals,Metallurgy and Materials》2009年第5期586-591,共6页Mao Wu Xin-bo He Zhuo-shen Shen Xuan-hui Qu; supported by the National Natural Science Foundation of China (No.50274014, 50774005);the Major State Basic Research Development Program of China (No.2006CB605207);the National High-Tech Research and Development Program of China (No.2006AA03Z557); A novel type of ZnO-Al2O3-B2O3-SiO2 glass-ceramics sealing to Kovar in electronic packaging was developed, whose thermal expansion coefficient and electrical resistance are 5.2× 10^-6/℃ and over 1×10^13 Ω·cm, res...; 关键词：electronic packaging materials GLASS-CERAMIC CRYSTALLIZATION WETTING SEALING

Influence of binder composition on the rheological behavior of injection-molded microsized SiC suspensions被引量：2: 《Journal of University of Science and Technology Beijing》2008年第3期297-301,共5页Islam S.Humail; the National Natural Science Foundation of China(No.50274014); The influence of four kinds of binders consisting of paraffin wax （PW）, random-polypropylene （RPP）, high-density polyethylene （HDPE）, and stearic acid （SA） on the theological behavior of injection-molded SiC f...; 关键词：SIC powder injection molding RHEOLOGY BINDER

放电等离子烧结制备Diamond/Al复合材料被引量：11: 《复合材料学报》2008年第6期192-197,共6页梁雪冰褚克贾成厂; 国家自然科学基金项目(50274014);民口配套研制项目(28300007); 采用放电等离子烧结法(SPS)制备了Diamond/Al复合材料,研究了金刚石粒径、成分配比、工艺参数等对复合材料的导热性能的影响。结果表明,SPS可以得到导热性能较好的Diamond/Al复合材料,致密度是影响该材料导热性能的最重要因素。在实验...; 关键词：Diamond/Al复合材料金刚石颗粒放电等离子烧结热导率

Electronic packaging materials prepared by powder injecting molding and pressure infiltration process: 《Rare Metals》2007年第6期625-629,共5页YIN Fazhang GUO Hong JIA Chengchang XU Jun ZHANG Ximin ZHU Xuexin; the National Natural Science Foundation of China (No. 50274014).; AlSiCp （65 vol.% SiC） electronic packaging materials were manufactured by powder injection molding （PIM） and pressure infiltration process in order to obtain near net-shaped parts. SiCp preformed compacts obtained...; 关键词：COMPOSITES ALUMINUM microstructure thermal conductivity

注射成形制备SiCp/Al复合材料电子封装盒体的预成形坯被引量：6: 《北京科技大学学报》2007年第5期470-474,共5页褚克贾成厂梁雪冰曲选辉; 国家自然科学基金资助项目(No.50274014);民口配套研制项目(No.28300007); 对碳化硅陶瓷注射喂料进行流变性能分析后得到合适的注射喂料.通过注射工艺和后续的脱脂-预烧结工艺成功制备出压渗用SiCp封装盒体的预成形坯.结果表明:SiCp装载量为65%,粘结剂成分为70%PW(石蜡)+29%HPDE(高密度聚乙烯)+1%SA(硬脂酸)的...; 关键词：电子封装材料碳化硅(SiC) 喂料注射成形脱脂

高体积分数SiC_P/Al复合材料电子封装盒体的制备被引量：20: 《复合材料学报》2006年第6期108-113,共6页褚克贾成厂尹法章梅雪珍曲选辉; 国家自然科学基金项目(50274014);民口配套研制项目(28300007); 采用注射成型方法制备了SiCP封装盒体的预成型坯,用压力浸渗方法将熔融铝浸渗到SiCP封装盒体的预成型坯中,制备出含SiCP体积分数为65%的SiCP/Al复合材料的封装盒体。SEM观察表明,经过压力浸渗后SiCP/Al复合材料组织均匀且致密化高,室温...; 关键词：SICP/AL复合材料脱脂注射成型压力熔渗

电子封装用高体积分数SiCp／Al复合材料的制备被引量：10: 《北京科技大学学报》2006年第5期444-447,共4页任淑彬何新波曲选辉叶斌; 国家自然科学基金资助项目(No.50274014); 采用粉末注射成形制备SiC预成形坯和Al合金无压熔渗相结合的工艺,用单一粒度的粉末成功地制备出了致密度为98．7％的60％SiCp／Al高体积分数复合材料．SEM分析表明,所制备的复合材料增强体和基体分布均匀,组织致密,热膨胀系数在100℃到...; 关键词：SICP/AL复合材料电子封装注射成形无压熔渗

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