Project supported by the National Natural Science Foundation of China(Grant No.62188102);the Natural Science Basic Research Program of Shaanxi Province,China(Grant No.2022JM-316);the Fund from the Ministry of Education of China(Grant No.8091B042112)。
A self-supporting T-shaped gate(SST-gate) GaN device and process method using electron beam lithography are proposed.An AlGaN/GaN high-electron-mobility transistor(HEMT) device with a gate length of 100 nm is fabricat...
supported by the National Key R&D Program of China,Grant No.2020YFA0712700;the National Natural Science Foundation of China,Grant No.11875317。
In the stabilizer formalism of fault-tolerant quantum computation,stabilizer states serve as classical objects,while magic states(non-stabilizer states)are a kind of quantum resource(called magic resource)for promotin...
supported by the National Key Research and Development Program of China(2017YFB0402900);the National Natural Sciences Foundation of China(62074144).
In this paper,we investigated the effect of post-gate annealing(PGA)on reverse gate leakage and the reverse bias reliability of Al_(0.23)Ga_(0.77)N/GaN high electron mobility transistors(HEMTs).We found that the Poole...
Project supported by the Foundation Project of the Science and Technology on Electro-Optical Information Security Control Laboratory,China(Grant No.614210701041705)
Using the semi-insulating property and small lattice constant a of wurtzite BGaN alloy, we propose a BGaN buffer with a B-content of 1% to enhance two-dimensional electron gas(2 DEG) confinement in a short-gate AlGaN/...
The DC and RF performance of 30 nm gate length enhancement mode (E-mode) InAlN/AIN/GaN high electron mobility transistor (HEMT) on SiC substrate with heavily doped source and drain region have been inves- tigated ...
supported by the National Natural Science Foundation of China(No.61404115,No.61434006);the Postdoctoral Science Foundation of Henan Province(No.2014006)
PMGI/ZEP520A/PMGI/ZEP520 A fourlayer resist stack is firstly proposed for T-gates fabrication of InP-based High electron mobility transistors(HEMTs).Gate-head and gate-foot are exposed in single-step Electron beam lit...
supported by the National Natural Science Foundation of China(No.61404115,No.61434006);the Postdoctoral Science Foundation of Henan Province(No.2014006)
T-Gate fabrication processes for In P-based High electron mobility transistors(HEMTs) are described using PMMA/Al/UVIII. The single-step and two-step Electron beam lithography(EBL) methods are proposed contrastively w...
Project supported by the National Basic Research Program of China(Grant No.2010CB327502)
InA1As/InGaAs high electron mobility transistors (HEMTs) on an InP substrate with well-balanced cutoff frequency fT and maximum oscillation frequency frnax are reported. An InA1As/InGaAs HEMT with 100-nm gate length...
Project supported by the National Basic Research Program of China(Grant Nos.2010CB327502 and 2010CB327505);the Advance Research Project(Grant No.5130803XXXX)
In this paper, 0.15-μm gate-length In0.52Al0.48As/In0.53Ga0.47As InP-based high electron mobility transistors (HEMTs) each with a gate-width of 2×50 μm are designed and fabricated. Their excellent DC and RF chara...
supported by the National Natural Science Foundation of China(Grant Nos.61274026,60274077 and 60976068);the Scientific Research Fund of Hunan Provincial Education Department(Grant No. 10C0709);the Science and Technology Plan Foundation of Hunan Province(Grant No.2011GK3058)
High performance 150-nm gate-length metamorphic Al0.48In0.52As/Ga0.47In0.53 As high electron mobility transistors(mHEMTs) with very good device performance have been successfully fabricated.A T-shaped gate is fabricat...