Project supported by the National Natural Science Foundation of China (Grant Nos. 60736033 and 60376024);the National Key Technology Research and Development Program of the Ministry of Science and Technology of China (Grant No. 2007BAK25B03)
This paper studies the effect of drain bias on ultra-short p-channel metal-oxide-semiconductor field-effect transistor (PMOSFET) degradation during negative bias temperature (NBT) stress. When a relatively large g...
The reverse generation current under high-gate-voltage stress condition in LDD nMOSFET's is studied. We find that the generation current peak decreases as the stress time increases. We ascribe this finding to the dom...
We investigate the negative bias temperature instability (NBTI) of 90nm pMOSFETs under various temperatures and stress gate voltages (Vg). We also study models of the time (t) ,temperature (T) ,and stress Vg d...
By measurement,we investigate the characteristics and location of gate oxide damage induced by snapback stress. The damage incurred during stress causes device degradation that follows an approximate power law with st...