supported by the National Natural Science Foundation of China(No.61176100)
A threshold-voltage model for a stacked high-k gate dielectric GaAs MOSFET is established by solving a two-dimensional Poisson's equation in channel and considering the short-channel, DIBL and quantum effects. The si...
Project supported by the Important National Science&Technology Specific Projects(No.2009ZX02035);the National Natural Science Foundation of China(Nos.61176091,61306129)
Positive bias temperature instability(PBTI) characteristics and degradation mechanisms of NMOSFET with high-k/metal gate last process have been systematically investigated. The time evolution of threshold voltage sh...
Project supported by the Innovative Fund of State Key Laboratory of Electronic Thin Films and Integrated Devices(No.CXJJ201103);the Fund of Analog Integrated Circuit Key Laboratory(No.9140C090301120C09035);the Scientific Research Project of Land and Resources Department of Sichuan Province(No.KJ-2013-12 2200199)
A stress modulation technology using a trench-based structure for strained NMOSFET is reported in this paper. With this technology, NMOSFET can be improved by a compressive contact etch stop layer(CESL), whereas the...
We investigate how F exposure impacts the hot-carrier degradation in deep submicron NMOSFET with different technologies and device geometries for the first time. The results show that hot-carrier degradations on irrad...
The hot-carrier effect charactenstic in a deep submicron partially depleted SOI NMOSFET is investigated. Obvious hot-carrier degradation is observed under off-state stress.The hot-carrier damage is supposed to be indu...
supposed by the National Basic Research Program of China;supposed by the State Key Laboratory of Electronic Thin Films and Integrated Devices,UESTC;the Science and Technology on Analog Integrated Circuit Laboratory,CETC
A fully standard CMOS integrated strained Si-channel NMOSFET has been demonstrated. By adjusting the thickness of graded SiGe, modifying the channel doping concentration, changing the Ge fraction of the relaxed SiGe l...
supported by the Specialized Research Fund of the Education Department of Shaanxi Province,China(No.11JK0902);the Innovational Fund for Applied Materials of Xi'an,China(No.XA-AM-201012)
The degradation of gate-induced drain leakage (GIDL) current in LDD nMOSFET under hot holes stress is studied in depth based on its parameter IDIFF. IDIFF is the difference of GIDL currents measured under two condit...
The effects of gamma irradiation on the shallow trench isolation(STI)leakage currents in a 0.18μm technology are investigated.NMOSFETs with different gate lengths are irradiated at several dose levels.The threshold...
Radiation experiments have been carried out with a SOI NMOSFET.The behavior of double humps was studied under irradiation.The characterization of the hump was demonstrated.The results have shown that the shape of the ...
supported by the National Natural Science Foundation of China (Nos. 60736033, 60506020)
The degradation of device under GIDL (gate-induced drain leakage current) stress has been studied using LDD NMOSFETs with 1.4 nm gate oxides. Experimental result shows that the degradation of device parameters depen...