相关期刊:《Protection and Control of Modern Power Systems》《Communications in Theoretical Physics》《Chinese Journal of Polymer Science》《Chinese Physics B》更多>>
supported by the MSIT(Ministry of Science and ICT),Korea,under the ITRC(Information Technology Research Center)support program(IITP-2020-2018-0-01421)supervised by the IITP(Institute for Information&communications Technology Promotion);then Samsung Electronics.
A split gate MOSFET(SG-MOSFET)is widely known for reducing the reverse transfer capacitance(C_(RSS)).In a 3.3 kV class,the SG-MOSFET does not provide reliable operation due to the high gate oxide electric field.In add...
supported by the National Science and Technology Major Project(No.2017YFB0102302)。
A 4H-SiC power MOSFET with specific on-resistance of 3.4 mΩ·cm^2 and breakdown voltage exceeding 1.5 kV is designed and fabricated.Numerical simulations are carried out to optimize the electric field strength in gat...
Project supported by the Guangxi Natural Science Foundation of China(No.2013GXNSFAA019335);the Guangxi Department of Education Project(No.201202ZD041);the China Postdoctoral Science Foundation Project(Nos.2012M521127,2013T60566);the National Natural Science Foundation of China(Nos.61361011,61274077,61464003)
A new high-voltage LDMOS with linearly-distanced fixed charge islands is proposed (LFI LDMOS). A lot of linearly-distanced fixed charge islands are introduced by implanting the Cs or I ion into the buried oxide laye...
supported by the National Natural Science Foundation of China(No.61274080);the Natural Science Foundation of Jiangsu Province(No.BK2011753);the Postdoctoral Science Foundation of China(No.2013M541585)
A lateral double-diffused metal-oxide-semiconductor field effect transistor (LDMOST) with multiple n-regions in the p-substrate is investigated in detail. Because of the decrescent n-regions, the electric field dist...
Project supported by the National Natural Science Foundation of China(No.61176069);the Program for New Century Excellent Talentsin University of Ministry of Education of China(No.NCET-11-0062);the China Postdoctoral Science Foundation(No.2012T50771)
A low specific on-resistance(R on;sp/ SOI NBL TLDMOS(silicon-on-insulator trench LDMOS with an N buried layer) is proposed. It has three features: a thin N buried layer(NBL) on the interface of the SOI layer/bur...
supported by the Guangxi Natural Science Foundation of China(No.2010GXNSFB013054);the Guangxi Key Science and Technology Program ofChina(No.11107001-20)
A new silicon-on-insulator(SOI) high-voltage MOSFET structure with a compensation layer on the trenched buried oxide layer(CL T-LDMOS) is proposed.The high density inverse interface charges at the top surface of the b...
supported by the National Natural Science Foundation of China(Nos.60976060,61176069);the National Key Laboratory of AnalogIntegrated Circuit(NLAIC),China(No.9140C090304110C0905);the State Key Laboratory of Electronic Thin Films and Integrated Devices,China(No.CXJJ201004)
An integrable silicon-on-insulator (SOl) power lateral MOSFET with a trench gate and a recessed drain (TGRD MOSFET) is proposed to reduce the on-resistance. Both of the trench gate extended to the buried oxide (...
Project supported by the Guangxi Natural Science Foundation of China(No.2010GXNSFB013054);the Guangxi Key Science and Technology Program of China(No.11107001-20)
A novel silicon double-RESURF LDMOS structure with an improved breakdown characteristic by substrate bias technology(SB) is reported.The P-type epitaxial layer is embedded between an N-type drift region and an N-typ...
supported by the National Natural Science Foundation of China(No.60906038);the Pre-Research Foundation,China(No. 9140A08010309DZ02);the Science-Technology Foundation for Young Scientist of University of Electronic Science and Technology of China(No.L08010301JX0830)
A 700 V triple RESURF nLDMOS with a low specific on-resistance of 100 mΩ.cm^2 is designed. Compared with a conventional double RESURF nLDMOS whose P-type layer is located on the surface of the drift region, the P-typ...
A novel structure of a VDMOS in reducing on-resistance is proposed. With this structure, the specific on-resistance value of the VDMOS is reduced by 22% of that of the traditional VDMOS structure as the breakdown volt...