Project supported by the National Basic Research Program of China(Grant No.2011CBA00606);the National Natural Science Foundation of China(Grant No.61106106)
The degradation produced by hot carrier (HC) in ultra-deep sub-micron n-channel metal oxide semiconductor field effect transistor (nMOSFET) has been analyzed in this paper. The generation of negatively charged int...
Project supported by the Beijing Natural Science Foundation,China(Grant No.4123106);the National Science and Technology Major Projects of the Ministry of Science and Technology of China(Grant No.2009ZX02035)
A gate-last process for fabricating HfSiON/TaN n-channel metal-oxide-semiconductor-field-effect transistors (NMOSFETs) is presented. In the process, a HfSiON gate dielectric with an equivalent oxide thickness of 10 ...
supposed by the National Basic Research Program of China;supposed by the State Key Laboratory of Electronic Thin Films and Integrated Devices,UESTC;the Science and Technology on Analog Integrated Circuit Laboratory,CETC
A fully standard CMOS integrated strained Si-channel NMOSFET has been demonstrated. By adjusting the thickness of graded SiGe, modifying the channel doping concentration, changing the Ge fraction of the relaxed SiGe l...
An analytical model of electron mobility for strained-silicon channel nMOSFETs is proposed in this paper. The model deals directly with the strain tensor,and thus is independent of the manufacturing process. It is sui...