Project supported by the Beijing Natural Science Foundation,China(Grant No.4123106);the National Science and Technology Major Projects of the Ministry of Science and Technology of China(Grant No.2009ZX02035)
A gate-last process for fabricating HfSiON/TaN n-channel metal-oxide-semiconductor-field-effect transistors (NMOSFETs) is presented. In the process, a HfSiON gate dielectric with an equivalent oxide thickness of 10 ...
Project supported by the Special Funds for Major State Basic Research Projects,China(No.2006CB302704 );the National Natural Science Foundation of China(No.60776030)
A novel dry etching process of a poly-Si/TaN/HfSiON gate stack for advanced complementary metal-oxide-semiconductor(CMOS) devices is investigated.Our strategy to process a poly-Si/TaN/HfSiON gate stack is that each ...
Project supported by the National Basic Research Program of China (Grant No. 2006CB302704)
Ge and Si p-channel metal-oxide-semiconductor field-effect-transistors (p-MOSFETs) with hafnium silicon oxynitride (HfSiON) gate dielectric and tantalum nitride (TAN) metal gate are fabricated. Self-isolated rin...
supported by the Special Funds for Major State Basic Research Projects(No.2006CB302704);the National Natural Science Foundation of China(No.60776030).
The wet etching properties ofa HfSiON high-k dielectric in HF-based solutions are investigated. HF-based solutions are the most promising wet chemistries for the removal of HfSiON, and etch selectivity of HF-based sol...
supported by the State Key Development Program for Basic Research of China (Grant No 2006CB302704);the National Natural Science Foundation of China (Grant No 60776030)
This paper presents a method using simple physical vapour deposition to form high-quality hafnium silicon oxynitride (HfSiON) on ultrathin SiO2 buffer layer. The gate dielectric with 10A (1A = 0.1 nm) equivalent o...