相关期刊:《Journal of Electronics Cooling and Thermal Control》《Journal of Semiconductors》《Circuits and Systems》《World Journal of Nano Science and Engineering》更多>>
CMOS technology is one of the most frequently used technologies in the semiconductor industry as it can be successfully integrated with ICs.Every two years the number of MOS transistors doubles because the size of the...
In this paper, thermal effects and Drain Induced barrier lowering (DIBL) of silicon-on-insulator (SOI) and silicon-on-diamond (SOD) transistors with 22 nm channel lengths using hydrodynamic simulations have been inves...
Project supported by the Weapon Equipment Pre-Research Foundation of China(Grant No.9140A11020114ZK34147);the Shanghai Municipal Natural Science Foundation,China(Grant No.15ZR1447100)
Total ionizing dose responses of different transistor geometries after being irradiated by ^(60)Co γ-rays, in 0.13-μm partially-depleted silicon-on-insulator(PD SOI) technology are investigated. The negative thr...
Continued scaling of CMOS technology to achieve high performance and low power consumption of semiconductor devices in the complex integrated circuits faces the degradation in terms of electrostatic integrity, short c...
TEQIP-II funded Silvaco TCAD;SMDP-II funded Cadence Tool in Department of Electronics and Communication Engineering,NIT Silchar for carrying out the research work
An enhancement mode p-GaN gate AlGaN/GaN HEMT is proposed and a physics based virtual source charge model with Landauer approach for electron transport has been developed using Verilog-A and simulated using Cadence Sp...
This is Part II of a two-part paper that explores the 28-nm UTBB FD-SOI CMOS and the 22-nm Tri-Gate FinFET technology as the better alternatives to bulk transistors especially when the transistor’s architecture is go...
The major purpose of this paper is to find an alternative configuration that not only minimizes the limitations of single-gate(SG) MOSFETs but also provides the better replacement for future technology.In this paper...
Nowadays, transistor technology is going toward the fully depleted architecture;the bulk transistors are becoming more complex in manufacturing as the transistor size is becoming smaller to achieve the high performanc...
This paper proposes the charge plasma based dual electrode doping-less tunnel FET (DEDLTFET). The paper compares the device performance of the conventional doping-less TFET (DLTFET) and doped TFET (DGTFET). DEDL...
supported by the Program for New Century Excellent Talents in University(Grant No.NCET-12-0915);the National Natural Science Foundation of China(Grant Nos.61334002 and 61204086)
In this paper,the off-state breakdown characteristics of two different AlGaN/GaN high electron mobility transistors(HEMTs),featuring a 50-nm and a 150-nm GaN thick channel layer,respectively,are compared.The HEMT wi...