supported by the Science and Technology Innovation Key R&D Program of Chongqing (Grant No.2023TIADSTX0037);the National Natural Science Foundation of China (Grant No.62404026);the General Program of National Natural Science Foundation of Chongqing (Grant Nos.CSTB2023NSCQ-MSX0475,CSTB2024NSCQ-MSX0331);the Science and Technology Research Program of Chongqing Municipal Education Commission (Grant No.KJQN202400609).
This paper presents a comprehensive analysis of the short-circuit failure mechanisms in commercial 1.2 kV planar sili-con carbide(SiC)metal–oxide–semiconductor field-effect transistors(MOSFETs)under 400 and 800 V bu...
supported by the National Natural Science Foundation of China(Grants Nos.12374070 and 12074103);the Foundation for University Key Young Teacher of Henan(Grant No.2023GGJS035);Henan Province Postdoctoral Project Launch Funding(Grant No.5201029430112);the Science and Technology Program of Henan(Grant No.232102230080);supported by the High Performance Computing Center of Henan Normal University.
Dielectric engineering plays a crucial role in the process of device miniaturization.Herein we investigate the electrical properties of bilayer GaSe metal-oxide-semiconductor field-effect transistors(MOSFETs),consider...
supported in part by the Natural Science Foundation of China(62125401 and 62074006);the major scientific instruments and equipments development grant(61927901);the Shenzhen Fundamental Research Program(GXWD20200827114656001).
In this work,a surface-potential based compact model focusing on the quantum confinement effects of ultimately scaled gate-all-around(GAA)MOSFET is presented.Energy quantization with sub-band formation along the radiu...
supported by the National Key R&D Program of China(2016YFB0100600);the Key Program of Bureau of Frontier Sciences and Education,Chinese Academy of Sciences(QYZDBSSW-JSC044)。
Compared to Si devices,the junction temperature of SiC devices is more critical due to the reliability concern introduced by immature packaging technology applied to new material.This paper proposes a practical SiC MO...
funding from the Electronic Component Systems for European Leadership Joint Undertaking (ECSEL JU),under grant agreement No.101007229;support from the European Union’s Horizon 2020 Research and Innovation Programme,Germany,France,Belgium,Austria,Sweden,Spain,and Italy
Vertical GaN power MOSFET is a novel technology that offers great potential for power switching applications.Being still in an early development phase,vertical GaN devices are yet to be fully optimized and require car...
The scaling of silicon-based metal-oxide-semiconductor fieldeffect transistors(MOSFETs)approaches its physical limits at a gate length(LG)of 12 nm and supply voltage(VDD)of 0.6 V according to the International Roadmap...
the Science andTechnology Project of State Grid Corporation of China (No. 52094021N012).
Threshold voltage (V_(TH)) hysteresis affects the dynamic characteristics of silicon carbide (SiC) MOSFETs, whichin turn affects reliability of a device. In this paper, a dynamichysteresis curve is proposed as an eval...
the Major Science and Technology Program of Anhui Province under Grant No.2020b05050007.
A silicon (Si)/silicon carbide (4H-SiC) heterojunction double-trench metal-oxide-semiconductor field effect transistor (MOSFET) (HDT-MOS) with the gate-controlled tunneling effect is proposed for the first time based ...