Y2000-62096-147 0010879利用 CMOS 传感器阵列的芯片应力特性的测试芯片=Test chip for die stress characterization using arrays ofCMOS sensors[会,英]/Bradley,A.T.& Jaeger,R.C.//Proceedings of the IEEE 1999 Custom Integrate...
Y2000-62027-337 0005805封装和组装(收录论文3篇)=Packaging and assembly[会,英]//1999 IEEE International Reliability PhysicsSymposium.—337~356(UC)收录本部分的论文题目有:利用静电力取样法的倒装片电路的背面测试技术,在塑...