Project supported by“Efficient and Energy-Saving GaN on Si Power Devices”Research Fund(Grant No.KQCX20140522151322946);the Research Fund of the Third Generation Semiconductor Key Laboratory of Shenzhen,China(Grant No.ZDSYS20140509142721434);the“Key Technology Research of GaN on Si Power Devices”Research Fund(Grant No.JSGG20140729145956266);the“Research of Low Cost Fabrication of GaN Power Devices and System Integration”Research Fund(Grant No.JCYJ201602261926390)
A novel enhancement-mode AlGaN/GaN high electron mobility transistor(HEMT) is proposed and studied.Specifically,several split floating gates(FGs) with negative charges are inserted to the conventional MIS structur...
Ku-band GaN power transistor with output power over 100 W under the pulsed operation mode is pre- sented. A high temperature A1N nucleation together with an Fe doped GaN buffer was introduced for the developed GaN HEM...
Project supported by the National Natural Science Foundation of China(Grant Nos.61334002,61106106,and 61204085)
The effects of gate length L_G on breakdown voltage VBRare investigated in AlGaN/GaN high-electron-mobility transistors(HEMTs) with L_G= 1 μm^20 μm. With the increase of L_G, VBRis first increased, and then satura...
Project supported by the National Natural Science Foundation of China(No.60890192)
A1GaN/GaN high electron-mobility transistors (HEMTs) with 5 nm A1N passivation by plasma en- hanced atomic layer deposition (PEALD) were fabricated, covered by 50 nm SiNx which was grown by plasma enhanced chemica...
Simulation studies are made on the large-signal RF performance and avalanche noise properties ofhet- erojunction double-drift region (DDR) impact avalanche transit time (IMPATT) diodes based on AlxGal-xN/GaN mater...
Project supported by the National Natural Science Foundation of China(Grant Nos.61334002 and 61106106);the Opening Project of Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory,China(Grant No.ZHD201206)
In this paper, we demonstrate that a Schottky drain can improve the forward and reverse blocking voltages (BVs) simultaneously in A1GaN/GaN high-electron mobility transistors (HEMTs). The mechanism of improving th...
Supported by the National Basic Research Program of China under Grant No 2010CB934104, and the National Natural Science Foundation of China under Grant No 61376069.
We investigate the impact of CHFa plasma treatment on the performance of AIGaN/GaN HEMT (F-HEMT) by a temperature-dependent measurement in the thermal range from 6 K to 295 K. Tlle temperature dependence of the tran...
supported by the National Natural Science Foundation of China(No.61106106);the Opening Project of Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory(No.ZHD201206);the Fundamental Research Funds for the Central Universities(Nos.K5051325004,K5051325002)
The breakdown and the current collapse characteristics of high electron mobility transistors (HEMTs) with a low power F-plasma treatment process are investigated. With the increase of F-plasma treatment time, the sa...
Project supported by the National Basic Research Program of China(Grant No.2009CB929303);the Knowledge Innovation Program of the Chinese Academy of Sciences(Grant Nos.Y0BAQ31001 and KJCX2-EW-705);the National Natural Science Foundation of China(Grant Nos.61271157,61107093,and 10834004)
We present a theoretical study on the electric field driven plasmon dispersion of the two-dimensional electron gas (2DEG) in A1GaN/GaN high electron mobility transistors (HEMTs). By introducing a drifted Fermi-Dir...