相关期刊:《Journal of Electronic Science and Technology》《Computers, Materials & Continua》《Chinese Physics B》《CES Transactions on Electrical Machines and Systems》更多>>
supported by Hunan Provincial Natural Science Foundation of China(Grant No.2024JJ6157);Natural Science Foundation of Changsha(Grant No.kq2208213);National Natural Science Foundation of China(Grant No.62122084);Education Department of Hunan Province(Grant No.22B0020);Synergetic Extreme Condition User Facility(Grant No.2024-SECUF-PT-001871);Fundamental Research Funds for the Central Universities(Grant No.531118010804)。
GaN outperforms silicon in applications with high power and high frequency owing to the high critical electric field and high electron mobility.However,the hole-based GaN transistors which are pivotal to the GaN-based...
the National Natural Science Foundation of China(Grant Nos.61974119 and 61834005).
Ga_(2)O_(3)is difficult to achieve p-type doping,which further hinders the development of Ga_(2)O_(3)-based power devices and is not conducive to the development of new devices with high power density and low power co...
supported in part by National Science Fund for Distinguished Young Scholars(Grant No.61925404);National Natural Science Foundation of China(Grant No.62074122);Fundamental Research Plan(Grant No.JCKY2020110B010);Major Projects of Shanxi Province(Grant No.20201102012)。
A study of 1.7 kV normally-off p-GaN gate high-electron-mobility transistors(HEMTs)on SiC substrates is presented.The fabricated p-GaN HEMT with a gate-drain spacing LGD=5μm exhibited a threshold voltage of 1.10 V,a ...
Supported by the National Natural Science Foundation of China(Grant No.61904207);scientific research support foundation for introduced high-level talents of Shenyang Ligong University(Grant No.1010147000914);the Natural Science Foundation of Sichuan Province,China(Grant No.2022NSFSC0886)
AlGaN/GaN heterojunction field-effect transistors(HFETs)with p-GaN cap layer are developed for normally-off operation,in which an in-situ grown AlN layer is utilized as the gate insulator.Compared with the SiNxgate in...
Project supported by the Research on Key Techniques in Reliability of Low Power Sensor Chip for IOTIPS and the Technology Project of Headquarters,State Grid Corporation of China(Grant No.5700-202041397A-0-0-00).
Based on the self-terminating thermal oxidation-assisted wet etching technique,two kinds of enhancement mode Al_(2)O_(3)/GaN MOSFETs(metal-oxide-semiconductor field-effect transistors)separately with sapphire substrat...
supported by the National Natural Science Foundation of China(Grant No.62074122);Key-Area Research and Development Program of Guangdong Province(Grant No.2020B010174001);National Key Science and Technology Special Project(Grant No.2019ZX01001101-010)。
In this study,we investigate heavy ion irradiation effects on commercial 650 V p-GaN normallyoff HEMTs.Ge and Cl ions are used to irradiate the GaN devices in the experiments.Ge and Cl ion beam irradiation have little...
supported by the National Natural Science Foundation of China(Grant No.62004150);Postdoctoral Science Foundation of China(Grant No.2018M643575);the Fundamental Research Funds for the Central Universities,and the Innovation Fund of Xidian University(Grant No.JB211104)。
A novel normally-off AlGaN/GaN high-electron-mobility transistor(HEMT)with a p-GaN Schottky hybrid gate(PSHG)is proposed,and compared with the conventional p-GaN normally-off AlGaN/GaN HEMTs.This structure can be real...
High electron mobility transistor(HEMT)based on gallium nitride(GaN)is one of the most promising candidates for the future generation of high frequencies and high-power electronic applications.This research work aims ...
Project supported by the Equipment Developing Advanced Research Program of China(Grant No.6140A24030107)。
The degradation mechanisms of enhancement-mode p-GaN gate AlGaN/GaN high-electron mobility transistor was analyzed extensively,by means of drain voltage stress and gate bias stress.The results indicate that:(ⅰ) High ...
Project supported by the National Natural Science Foundation of China (Grant Nos. 61704124, 11690042, and 61634005).
Trapping effect in normally-off Al2O3/AlGaN/GaN metal–oxide–semiconductor (MOS) high-electron-mobility transistors (MOS-HEMTs) with post-etch surface treatment was studied in this paper. Diffusion-controlled interfa...