: We propose a new structure of InxAll-xN/GaN high electron mobility transistor (HEMT) with gate length of 20 nm. The threshold voltage of this HEMT is achieved as -0.472 V. In this device the InA1N barrier layer i...
Project supported by the National Basic Research Program of China(Nos.2010CB327502,2010CB327505);the Advance Research Project(No.5130803XXXX)
AW-bandtwo-stageamplifierMMIChasbeendevelopedusingafullypassivated 2 × 20 μm gate-width and 0.15 μm gate-length InP-based high electron mobility transistor (HEMT) technology. The two-stage amplifier has been real...
Project(Z132012A001)supported by the Technical Basis Research Program in Science and Industry Bureau of China;Project(61201028,60876009)supported by the National Natural Science Foundation of China
InGaAs high electron mobility transistors (HEMTs) on InP substrate with very good device performance have been grown by mental organic chemical vapor deposition (MOCVD). Room temperature Hall mobilities of the 2-D...
An 88 nm gate-length In0.53Ga0.47As/In0.52Alo.48As InP-based high electron mobility transistor (HEMT) was successfully fabricated with a gate width of 2× 50 μm and source-drain space of 2.4μm. The T-gate was defi...
supported by the Young Scientists Fund of the National Natural Science Foundation of China(No.60806024);the Fundamental Research Funds for Central University,China(No.XDJK2009C020)
A new PMMA/PMGI/ZEP520/PMGI four-layer resistor electron beam lithography technology is successfully developed and used to fabricate a 120 nm gate-length lattice-matched In_(0.53)Ga_(0.47)As/In_(0.52)Al_(0.48)...
Project supported by the National Natural Science Foundation of China(No.60806024);the Fundamental Research Funds for the Central Universities,China(No.XDJK2009C020).
120 nm gate-length In_(0.7)Ga_(0.3)As/In_(0.52)Al_(0.48) As InP-based high electron mobility transitions(HEMTs) are fabricated by a new T-shaped gate electron beam lithograph(EBL) technology,which is achie...
the National Basic Research Program of China (Grant No. G2002CB311901);Equipment Advance Research Project (Grant No. 61501050401C);Institute of Microelectronics, Chinese Academy of Sciences, Dean Fund (Grant No. 06SB124004)
GaAs-based metamorphic HEMTs (MHEMT) consist of GaAs substrates and InP-based epitaxial structure, and have the advantages of both InP HEMT's excellent performances and GaAs-based HEMT's mature processes. GaAs-based M...
1.0μm gate-length GaAs-based MHEMTs have been fabricated by MBE epitaxial material and contact-mode lithography technology. Pt/Ti/Pt/Au and Ti/Pt/Au were evaporated to form gate metals. Excellent DC and RF performanc...
MOCVD-grown 0.25μm gate-length AlGaN/GaN high electron mobility transistors (HEMTs) are fabricated on sapphire substrates. A peak extrinsic transconductance of 250mS/mm and a unity current gain cutoff frequency (f...
the National Scjcnce Foundation of China, Grant No:6883028
<正> The two dimensional steady stale numerical simulation system MESS for C-band power GaAs MESFET’s by finite clement method is presented in this paper. The improved charge lumping method and the hybrid fini...